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JHQ-400 laser cutting machine is mainly used for precision cutting of high-brightness LED sapphire wafers, thyristors, gallium arsenide, triodes, silicon carbide and other semiconductor materials. At present, it has the functions of graphic alignment, automatic θ-direction rotation, front side cutting, back side cutting, etc. The performance index has reached the international advanced level of similar products.
On the basis of the existing technology, Chinese electric technicians further improve and perfect the image automatic alignment and optical path design, and realize the auxiliary functions such as online detection of laser machine. On the basis of market development, we will actively carry out market promotion, conduct targeted research on customer requirements, promote the industrialization of LED laser cutting equipment, and further enhance equipment performance and market competitiveness.
China Electric Power Research and Development JHQ-400 laser cutting machine passed user assessment
Recently, the "High Brightness LED Wafer Cutting Process and Equipment" developed by the 45th Research Institute of China Electronics Branch - JHQ-400 laser cutting machine passed the user assessment and applied for 9 national invention patents. Chemical production capacity and market competitiveness.