Recently, Japan's new-generation coating type electronic component technology research alliance (ECOW) announced the development of a technology for directly spraying organic semiconductor materials. The new technology is expected to become the third organic semiconductor film-forming technology that uses “electrostatic spray deposition (ESD)†technology instead of vacuum evaporation technology and coating technology such as spin coating and inkjet. The alliance includes a total of 8 groups including the Institute of Physical Chemistry, Saitama University, Cornell, Toray Engineering, and FLOX. ESD combines the advantages of vacuum evaporation technology and coating technology to solve many problems of these two technologies. In ESD, the particle size of the particles ejected by the nozzle is very small. Before reaching the cathode, the water in the paint almost evaporates, and thus a film forming effect close to vacuum evaporation can be obtained. It is understood that the new technology retains the advantages of coating at room temperature and pressure, film formation without vacuum, and easy film formation in large areas. ECOW plans to establish mass production technology by the beginning of 2016 and begin product supply in 2017.
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Japan ECOW develops a new generation of direct spray organic semiconductor material technology