The chip capacitor is formed by sintering a single high temperature, and the ceramic dielectric film printed with the internal electrode is laminated in a certain misalignment manner. And its structure is relatively simple, mainly composed of ceramic medium and electrode ZHEJIANG HESHUO TECHNOLOGY CO.,LTD , https://www.hosuocn.com
Maybe you know about the chip capacitors, you know that the chip capacitor materials are NPO, X7R.... or know the chip capacitor accuracy.
The grades are M, K, J.... But do you really understand the chip capacitors? Below, Pingshang Technology Chengdu chip capacitor will take you away
The world of patch capacitors begins with its construction and principles.
The chip capacitor is formed by sintering a single high temperature, and the ceramic dielectric film printed with the internal electrode is laminated in a certain misalignment manner.
The structure is also relatively simple, mainly composed of ceramic media and electrodes: 
The electrode is divided into a terminal electrode and an inner electrode: the terminal electrode generally comprises three parts: a base layer, a barrier layer and a solder layer. The base layer is often copper
Metal electrode or silver metal electrode, the main function is to connect with the internal electrode to extract the capacity; the barrier layer belongs to the nickel plating layer, and its main realization
Thermal blocking; the solder layer belongs to the Sn layer, its main function is to provide a solder metal layer; the inner electrode is located inside the chip capacitor, mainly
The facing area of ​​the electrode plates is provided, which is generally stacked alternately with the ceramic medium.
The classification and material of ceramic media are many. The more commonly used materials are COG, X7R, etc.
Dielectric energy storage.
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